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Results: 1-12 |
Results: 12
Post-weld-shift in dual-in-line laser package
Authors: Kuang, JH Sheen, MA Wang, SC Wang, GL Cheng, WH
Citation: Jh. Kuang et al., Post-weld-shift in dual-in-line laser package, IEEE T AD P, 24(1), 2001, pp. 81-85
The effect of tooth wear on the vibration spectrum of a spur gear pair
Authors: Kuang, JH Lin, AD
Citation: Jh. Kuang et Ad. Lin, The effect of tooth wear on the vibration spectrum of a spur gear pair, J VIB ACOUS, 123(3), 2001, pp. 311-317
Fiber alignment shift formation mechanisms of fiber-solder-ferrule joints in laser module packaging
Authors: Cheng, WH Sheen, MT Wang, GL Wang, SC Kuang, JH
Citation: Wh. Cheng et al., Fiber alignment shift formation mechanisms of fiber-solder-ferrule joints in laser module packaging, J LIGHTW T, 19(8), 2001, pp. 1177-1184
Mode localization in a rotating mistuned turbo disk with Coriolis effect
Authors: Huang, BW Kuang, JH
Citation: Bw. Huang et Jh. Kuang, Mode localization in a rotating mistuned turbo disk with Coriolis effect, INT J MECH, 43(7), 2001, pp. 1643-1660
Reduction of fiber alignment shifts in semiconductor laser module packaging
Authors: Cheng, WH Sheen, MT Chien, CP Chang, HL Kuang, JH
Citation: Wh. Cheng et al., Reduction of fiber alignment shifts in semiconductor laser module packaging, J LIGHTW T, 18(6), 2000, pp. 842-848
Use of strip yield approach for multiple-site damage failure scenarios
Authors: Kuang, JH Chen, CK
Citation: Jh. Kuang et Ck. Chen, Use of strip yield approach for multiple-site damage failure scenarios, J AIRCRAFT, 37(5), 2000, pp. 887-891
Alternating iteration method for interacting multiple crack problems
Authors: Kuang, JH Chen, CK
Citation: Jh. Kuang et Ck. Chen, Alternating iteration method for interacting multiple crack problems, FATIG FRACT, 22(9), 1999, pp. 743-752
Crack formation mechanism in laser-welded Au-coated Invar materials for semiconductor laser packaging
Authors: Kuang, JH Sheen, MT Wang, SC Chen, CH Cheng, WH
Citation: Jh. Kuang et al., Crack formation mechanism in laser-welded Au-coated Invar materials for semiconductor laser packaging, IEEE T AD P, 22(1), 1999, pp. 94-100
Mode localization of a cracked blade disk
Authors: Kuang, JH Huang, BW
Citation: Jh. Kuang et Bw. Huang, Mode localization of a cracked blade disk, J ENG GAS T, 121(2), 1999, pp. 335-341
The principle cause of crack defects in optoelectronic materials with phosphorus-containing underlayer
Authors: Cheng, WH Sheen, MT Kuang, JH Chen, CH
Citation: Wh. Cheng et al., The principle cause of crack defects in optoelectronic materials with phosphorus-containing underlayer, J ELEC MAT, 28(1), 1999, pp. 50-56
Thermal stresses in box-type laser packages
Authors: Cheng, WH Yang, YD Liang, TC Wang, GL Sheen, MT Kuang, JH
Citation: Wh. Cheng et al., Thermal stresses in box-type laser packages, OPT QUANT E, 31(4), 1999, pp. 293-302
The effect of blade crack on mode localization in rotating bladed disks
Authors: Kuang, JH Huang, BW
Citation: Jh. Kuang et Bw. Huang, The effect of blade crack on mode localization in rotating bladed disks, J SOUND VIB, 227(1), 1999, pp. 85-103
Risultati: 1-12 |