Authors:
HAMIDI A
COQUERY G
LALLEMAND R
VALES P
DORKEL JM
Citation: A. Hamidi et al., TEMPERATURE-MEASUREMENTS AND THERMAL MODELING OF HIGH-POWER IGBT MULTICHIP MODULES FOR RELIABILITY INVESTIGATIONS IN TRACTION APPLICATIONS, Microelectronics and reliability, 38(6-8), 1998, pp. 1353-1359