Authors: ROSTEN HI LASANCE CJM PARRY JD

Citation: Hi. Rosten et al., THE WORLD OF THERMAL CHARACTERIZATION ACCORDING TO DELPHI - PART I - BACKGROUND TO DELPHI, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 384-391

Authors: LASANCE CJM ROSTEN HI PARRY JD

Citation: Cjm. Lasance et al., THE WORLD OF THERMAL CHARACTERIZATION ACCORDING TO DELPHI - PART II -EXPERIMENTAL AND NUMERICAL-METHODS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 392-398

Authors: VINKE H LASANCE CJM

Citation: H. Vinke et Cjm. Lasance, COMPACT MODELS FOR ACCURATE THERMAL CHARACTERIZATION OF ELECTRONIC PARTS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 411-419

Authors: MEINDERS ER VANDERMEER TH HANJALIC K LASANCE CJM

Citation: Er. Meinders et al., APPLICATION OF INFRARED THERMOGRAPHY TO THE EVALUATION OF LOCAL CONVECTIVE HEAT-TRANSFER ON ARRAYS OF CUBICAL PROTRUSIONS, International journal of heat and fluid flow, 18(1), 1997, pp. 152-159

Authors: LASANCE CJM VINKE H ROSTEN H

Citation: Cjm. Lasance et al., THERMAL CHARACTERIZATION OF ELECTRONIC DEVICES WITH BOUNDARY-CONDITION INDEPENDENT COMPACT MODELS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 723-731