Authors: LE HA TSO NC ROST TA KIM CU

Citation: Ha. Le et al., INFLUENCE OF W-VIA ON THE MECHANISM OF ELECTROMIGRATION FAILURE IN AL-0.5 CU INTERCONNECTS, Applied physics letters, 72(22), 1998, pp. 2814-2816

Authors: MCPHERSON JW LE HA GRAAS CD

Citation: Jw. Mcpherson et al., RELIABILITY CHALLENGES FOR DEEP-SUBMICRON INTERCONNECTS, Microelectronics and reliability, 37(10-11), 1997, pp. 1469-1477

Authors: LE HA TSO NC MCPHERSON JW

Citation: Ha. Le et al., ELECTROMIGRATION PERFORMANCE OF W-PLUG VIA-FED LEAD STRUCTURES, Journal of the Electrochemical Society, 144(7), 1997, pp. 2522-2525