Authors: FALTERMEIER J KNORR A TALEVI R GUNDLACH H KUMAR KA PETERSON GG KALOYEROS AE SULLIVAN JJ LOAN J

Citation: J. Faltermeier et al., INTEGRATED PLASMA-PROMOTED CHEMICAL-VAPOR-DEPOSITION ROUTE TO ALUMINUM INTERCONNECT AND PLUG TECHNOLOGIES FOR EMERGING COMPUTER CHIP METALLIZATION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(5), 1997, pp. 1758-1766