Authors: Lakshmanan, SK Gill, WN

Citation: Sk. Lakshmanan et Wn. Gill, A new feature scale modem, and experiments of the hydrogen plasma assistedchemical vapor deposition of copper, CHEM ENG CO, 182, 2000, pp. 99-119

Authors: Lakshmanan, SK Gill, WN

Citation: Sk. Lakshmanan et Wn. Gill, A novel model of hydrogen plasma assisted chemical vapor deposition of copper, THIN SOL FI, 338(1-2), 1999, pp. 24-39

Authors: Lanford, WA Bedell, S Isberg, P Hjorvarsson, B Lakshmanan, SK Gill, WN

Citation: Wa. Lanford et al., Low temperature transport of Al into and through copper starting with Cu/Al/SiO2 bilayers, J APPL PHYS, 85(3), 1999, pp. 1487-1495