Authors:
Chen, F
Li, BZ
Sullivan, TD
Gonzalez, CL
Muzzy, CD
Lee, HK
Levy, MD
Dashiell, MW
Kolodzey, J
Citation: F. Chen et al., Influence of underlying interlevel dielectric films on extrusion formationin aluminum interconnects, J VAC SCI B, 18(6), 2000, pp. 2826-2834