Authors: Cai, CX Lumpp, JK

Citation: Cx. Cai et Jk. Lumpp, Microstructural studies of Cu brazing on AlN, J MATER RES, 16(3), 2001, pp. 670-677

Authors: Ball, JC Lumpp, JK Daunert, S Bachas, LG

Citation: Jc. Ball et al., Effect of fabrication factors on performance of screen-printed/laser micromachined electrochemical nanovials, ELECTROANAL, 12(9), 2000, pp. 685-690

Authors: Grimes, CA Lumpp, JK

Citation: Ca. Grimes et Jk. Lumpp, Control of the permeability loss-peak frequency of Ni81Fe19 thin films through laser ablation of triangular and square cluster geometries, J APPL PHYS, 87(9), 2000, pp. 5254-5256

Authors: Ball, JC Scott, DL Lumpp, JK Daunert, S Wang, J Bachas, LG

Citation: Jc. Ball et al., Electrochemistry in nanovials fabricated by combining screen printing and laser micromachining, ANALYT CHEM, 72(3), 2000, pp. 497-501