Citation: Sg. Lee et al., A multi-objective methodology for evaluating product end-of-life options and disassembly, INT J ADV M, 18(2), 2001, pp. 148-156
Citation: Sw. Lye et al., Numerical modeling of the temperature distribution within a bonded paper web when undergoing microwave heating in a waveguide, J MICROW P, 35(2), 2000, pp. 125-132
Citation: Sw. Lye et al., An algorithm for optimising the servicing of products with constrained, multiple defects, INT J PROD, 38(10), 2000, pp. 2185-2200
Citation: Sw. Lye et Ssg. Lee, Redesigning protective packaging buffers from the failure modes derived from crack characteristics, J APPL POLY, 72(5), 1999, pp. 721-731