Citation: S. Lee et al., SEMITHERM XIII - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 382-383
Citation: Sh. Reitsma et al., NUMERICAL-SIMULATION OF RECEPTIVITY PHENOMENA IN TRANSITIONAL BOUNDARY-LAYER FLOWS, AIAA journal, 35(5), 1997, pp. 789-795
Citation: Vp. Manno et al., SEMITHERM-XII - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(4), 1996, pp. 449-450
Citation: Vp. Manno et Re. Simons, CONTRIBUTIONS FROM THE SEMITHERM-XI CONFERENCE - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 721-722
Citation: J. Burgos et al., ACHIEVING ACCURATE THERMAL CHARACTERIZATION USING A CFD CODE - A CASE-STUDY OF PLASTIC PACKAGES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 732-738
Citation: Vp. Manno et Re. Simons, CONTRIBUTIONS FROM THE 10TH SEMITHERM SYMPOSIUM - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(1), 1995, pp. 30-30
Citation: Ph. Seong et al., DIAGNOSTIC ENTROPY - A QUANTITATIVE MEASURE OF THE EFFECTS OF SIGNAL INCOMPLETENESS ON SYSTEM DIAGNOSIS, Reliability engineering & systems safety, 45(3), 1994, pp. 235-248