Authors: ZHANG WG WU D SU BZ HAREB SA LEE YC MASTERSON BP

Citation: Wg. Zhang et al., THE EFFECT OF UNDERFILL EPOXY ON WARPAGE IN FLIP-CHIP ASSEMBLIES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 323-329

Authors: WOOD CS BENNETT SC CHO D MASTERSON BP ROBERTS JL TANNER CE WIEMAN CE

Citation: Cs. Wood et al., MEASUREMENT OF PARITY NONCONSERVATION AND AN ANAPOLE MOMENT IN CESIUM, Science, 275(5307), 1997, pp. 1759-1763