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Citation: Cy. Huang et al., THE SOLDERABILITY EVALUATION OF SURFACE-MOUNT COMPONENTS THROUGH THE USE OF WETTING BALANCE ANALYSIS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(1), 1996, pp. 23-37

Authors: WU CH SRIHARI K MCLENAGHAN AJ

Citation: Ch. Wu et al., A KNOWLEDGE-BASED THERMAL PROFILE IDENTIFICATION ADVISER FOR SURFACE-MOUNT PCB ASSEMBLY, International journal, advanced manufacturing technology, 11(5), 1996, pp. 343-352