AAAAAA
Results: 1-25/31
Authors:
KIM HJ
KIM YH
MORRIS JW
Citation: Hj. Kim et al., THERMAL MECHANISMS OF GRAIN AND PACKET REFINEMENT IN A LATH MARTENSITIC STEEL, ISIJ international, 38(11), 1998, pp. 1277-1285
Authors:
HAN JH
SHIN MC
KANG SH
MORRIS JW
Citation: Jh. Han et al., EFFECTS OF PRECIPITATE DISTRIBUTION ON ELECTROMIGRATION IN AL-CU THIN-FILM INTERCONNECTS, Applied physics letters, 73(6), 1998, pp. 762-764
Authors:
WANG ML
HUANG L
BONGARDPIERCE DK
BELMONTE S
ZACHGO EA
MORRIS JW
DOLAN M
GOODMAN HM
Citation: Ml. Wang et al., CONSTRUCTION OF AN SIMILAR-TO-2 MB CONTIG IN THE REGION AROUND 80 CM OF ARABIDOPSIS-THALIANA CHROMOSOME-2, Plant journal, 12(3), 1997, pp. 711-730
Authors:
SKARPELOS P
MORRIS JW
Citation: P. Skarpelos et Jw. Morris, THE EFFECT OF SURFACE-MORPHOLOGY ON FRICTION DURING FORMING OF ELECTROGALVANIZED SHEET STEEL, Wear, 212(2), 1997, pp. 165-172
Authors:
KIM CU
MORRIS JW
LEE HM
Citation: Cu. Kim et al., KINETICS OF ELECTROMIGRATION-INDUCED EDGE DRIFT IN AL-CU THIN-FILM INTERCONNECTS, Journal of applied physics, 82(4), 1997, pp. 1592-1598
Authors:
KANG SH
MORRIS JW
Citation: Sh. Kang et Jw. Morris, MICROSTRUCTURAL EVOLUTION OF AL-CU THIN-FILM CONDUCTING LINES DURING POST-PATTERN ANNEALING, Journal of applied physics, 82(1), 1997, pp. 196-200
Authors:
CHU D
MORRIS JW
Citation: D. Chu et Jw. Morris, THE INFLUENCE OF MICROSTRUCTURE ON WORK-HARDENING IN ALUMINUM, Acta materialia, 44(7), 1996, pp. 2599-2610
Authors:
XU P
MORRIS JW
Citation: P. Xu et Jw. Morris, COMPUTER-SIMULATION OF REVERSIBLE MARTENSITIC TRANSFORMATIONS, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 27(5), 1996, pp. 1187-1201
Authors:
YOO CH
LEE HM
CHAN JW
MORRIS JW
Citation: Ch. Yoo et al., M(2)C PRECIPITATES IN ISOTHERMAL TEMPERING OF HIGH CO-NI SECONDARY HARDENING STEEL, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 27(11), 1996, pp. 3466-3472
Authors:
MORRIS JW
KIM CU
KANG SH
Citation: Jw. Morris et al., THE METALLURGICAL CONTROL OF ELECTROMIGRATION FAILURE IN NARROW CONDUCTING LINES, JOM, 48(5), 1996, pp. 43-46
Authors:
KIM CU
KANG SH
MORRIS JW
Citation: Cu. Kim et al., EFFECT OF CURRENT REVERSAL ON THE FAILURE-MECHANISM OF AL-CU-SI NARROW INTERCONNECTS, Journal of electronic materials, 25(2), 1996, pp. 293-296
Authors:
KANG SH
KIM C
MORRIS JW
GENIN FY
Citation: Sh. Kang et al., EFFECT OF POST-PATTERN ANNEALING ON THE GRAIN-STRUCTURE AND RELIABILITY OF AL-BASED INTERCONNECTS, Journal of applied physics, 79(11), 1996, pp. 8330-8335
Authors:
MEI Z
KRENN CR
MORRIS JW
Citation: Z. Mei et al., INITIATION AND GROWTH OF SMALL FATIGUE CRACKS IN A NI-BASE SUPERALLOY, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 26(8), 1995, pp. 2063-2073
Authors:
REYNOLDS HL
MORRIS JW
Citation: Hl. Reynolds et Jw. Morris, THE ROLE OF CU-SN INTERMETALLICS IN WETTABILITY DEGRADATION, Journal of electronic materials, 24(10), 1995, pp. 1429-1434
Authors:
GJERTSON DW
MORRIS JW
Citation: Dw. Gjertson et Jw. Morris, ASSESSING PROBABILITY OF PATERNITY AND THE PRODUCT RULE IN DNA SYSTEMS, Genetica, 96(1-2), 1995, pp. 89-98
Authors:
KRAMER PA
GLAZER J
MORRIS JW
Citation: Pa. Kramer et al., THE EFFECT OF LOW GOLD CONCENTRATIONS ON THE CREEP OF EUTECTIC TIN-LEAD JOINTS, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 25(6), 1994, pp. 1249-1257
Authors:
GOLDSTEIN JLF
MORRIS JW
Citation: Jlf. Goldstein et Jw. Morris, THE EFFECT OF SUBSTRATE ON THE MICROSTRUCTURE AND CREEP OF EUTECTIC IN-SN, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 25(12), 1994, pp. 2715-2722
Authors:
SELITSER SI
MORRIS JW
Citation: Si. Selitser et Jw. Morris, SUBSTRUCTURE FORMATION DURING PLASTIC-DEFORMATION, Acta metallurgica et materialia, 42(12), 1994, pp. 3985-3991
Authors:
JIN S
FREAR DR
MORRIS JW
Citation: S. Jin et al., UNTITLED, Journal of electronic materials, 23(8), 1994, pp. 691-691
Authors:
BARTELS F
MORRIS JW
DALKE G
GUST W
Citation: F. Bartels et al., INTERMETALLIC PHASE-FORMATION IN THIN SOLID-LIQUID DIFFUSION COUPLES, Journal of electronic materials, 23(8), 1994, pp. 787-790
Authors:
CINQUE RB
MORRIS JW
Citation: Rb. Cinque et Jw. Morris, THE EFFECT OF GOLD-NICKEL METALLIZATION MICROSTRUCTURE ON FLUXLESS SOLDERING, Journal of electronic materials, 23(6), 1994, pp. 533-539
MICROSTRUCTURAL DEVELOPMENT OF EUTECTIC BI-SN AND EUTECTIC IN-SN DURING HIGH-TEMPERATURE DEFORMATION
Authors:
GOLDSTEIN JLF
MORRIS JW
Citation: Jlf. Goldstein et Jw. Morris, MICROSTRUCTURAL DEVELOPMENT OF EUTECTIC BI-SN AND EUTECTIC IN-SN DURING HIGH-TEMPERATURE DEFORMATION, Journal of electronic materials, 23(5), 1994, pp. 477-486
Authors:
BEZUIDENHOUT H
BREDENKAMP GJ
THERON GK
MORRIS JW
Citation: H. Bezuidenhout et al., A BRAUN-BLANQUET RECLASSIFICATION OF THE BANKENVELD GRASSLAND IN THE LICHTENBURG AREA, SOUTH-WESTERN TRANSVAAL, South African journal of botany, 60(6), 1994, pp. 297-305
Authors:
BEZUIDENHOUT H
BREDENKAMP GJ
THERON GK
MORRIS JW
Citation: H. Bezuidenhout et al., BRAUN-BLANQUET RECLASSIFICATION OF THE CYMBOPOGON-THEMEDA GRASSLAND IN THE LICHTENBURG AREA, SOUTH-WESTERN TRANSVAAL, South African journal of botany, 60(6), 1994, pp. 306-314
Authors:
KIM C
SELITSER SI
MORRIS JW
Citation: C. Kim et al., INFLUENCE OF MICROSTRUCTURE ON THE RESISTIVITY OF AL-CU-SI THIN-FILM INTERCONNECTS, Journal of applied physics, 75(2), 1994, pp. 879-884