Login
|
New Account
AAAAAA
ITA
ENG
Results:
1-1
|
Results: 1
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
Authors:
Hu, CK Gignac, L Malhotra, SG Rosenberg, R Boettcher, S
Citation:
Ck. Hu et al., Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections, APPL PHYS L, 78(7), 2001, pp. 904-906
Risultati:
1-1
|