Authors: Miao, HW Duh, JG

Citation: Hw. Miao et Jg. Duh, Microstructure evolution in Sn-Bi and Sn-Bi-Cu solder joints under thermalaging, MATER CH PH, 71(3), 2001, pp. 255-271

Authors: Miao, HW Duh, JG Chiou, BS

Citation: Hw. Miao et al., Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints, J MAT S-M E, 11(8), 2000, pp. 609-618