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Results: 2
An analytical model of multiple ILD thickness variation induced by interaction of layout pattern and CMP process
Authors:
Ouyang, C Ryu, K Milor, L Maly, W Hill, G Peng, YK
Citation:
C. Ouyang et al., An analytical model of multiple ILD thickness variation induced by interaction of layout pattern and CMP process, IEEE SEMIC, 13(3), 2000, pp. 286-292
Untitled
Authors:
Guardiani, C Milor, L
Citation:
C. Guardiani et L. Milor, Untitled, IEEE SEMIC, 12(4), 1999, pp. 385-385
Risultati:
1-2
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