Authors: Shen, YL Guo, YL Minor, CA

Citation: Yl. Shen et al., Voiding induced stress redistribution and its reliability implications in metal interconnects, ACT MATER, 48(8), 2000, pp. 1667-1678

Authors: Minor, CA Guo, YL Shen, YL

Citation: Ca. Minor et al., On the propensity of electromigration void growth from preexisting stress-voids in metal interconnects, SCR MATER, 41(4), 1999, pp. 347-352