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Results:
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Results: 3
Effect of oxygen on the reactions in the Si/Ta/Cu metallization system
Authors:
Laurila, T Zeng, KJ Kivilahti, JK Molarius, J Suni, I
Citation:
T. Laurila et al., Effect of oxygen on the reactions in the Si/Ta/Cu metallization system, J MATER RES, 16(10), 2001, pp. 2939-2946
Chemical stability of Ta diffusion barrier between Cu and Si
Authors:
Laurila, T Zeng, K Kivilahti, JK Molarius, J Suni, I
Citation:
T. Laurila et al., Chemical stability of Ta diffusion barrier between Cu and Si, THIN SOL FI, 373(1-2), 2000, pp. 64-67
Failure mechanism of Ta diffusion barrier between Cu and Si
Authors:
Laurila, T Zeng, KJ Kivilahti, JK Molarius, J Suni, I
Citation:
T. Laurila et al., Failure mechanism of Ta diffusion barrier between Cu and Si, J APPL PHYS, 88(6), 2000, pp. 3377-3384
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1-3
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