Authors: Wrschka, P Hernandez, J Oehrlein, GS Negrych, JA Haag, G Rau, P Currie, JE

Citation: P. Wrschka et al., Development of a slurry employing a unique silica abrasive for the CMP of Cu Damascene structures, J ELCHEM SO, 148(6), 2001, pp. G321-G325