Authors: Niklaus, F Enoksson, P Griss, P Kalvesten, E Stemme, G

Citation: F. Niklaus et al., Low-temperature wafer-level transfer bonding, J MICROEL S, 10(4), 2001, pp. 525-531

Authors: Niklaus, F Kalvesten, E Stemme, G

Citation: F. Niklaus et al., Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays, J MICROM M, 11(5), 2001, pp. 509-513

Authors: Niklaus, F Enoksson, P Kalvesten, E Stemme, G

Citation: F. Niklaus et al., Low-temperature full wafer adhesive bonding, J MICROM M, 11(2), 2001, pp. 100-107

Authors: Andersson, H van der Wijngaart, W Griss, P Niklaus, F Stemme, G

Citation: H. Andersson et al., Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels, SENS ACTU-B, 75(1-2), 2001, pp. 136-141

Authors: Niklaus, F Andersson, H Enoksson, P Stemme, G

Citation: F. Niklaus et al., Low temperature full wafer adhesive bonding of structured wafers, SENS ACTU-A, 92(1-3), 2001, pp. 235-241