Authors: Huang, JS Gates, AS Kang, SH Shofner, TL Ashton, RA Obeng, YS

Citation: Js. Huang et al., Comparative study on the effect of misalignment on bordered and borderlesscontacts, J ELEC MAT, 30(4), 2001, pp. 360-366

Authors: Huang, JS Deng, XJ Yih, PH Shofner, TL Obeng, YS Darling, C

Citation: Js. Huang et al., Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection, THIN SOL FI, 397(1-2), 2001, pp. 186-193

Authors: Obeng, YS Kang, SH Huang, JS Oates, AS Lin, X Obeng, JS

Citation: Ys. Obeng et al., Impact of post via-etch cleans on mechanical reliability of W-plug vias, THIN SOL FI, 391(1), 2001, pp. 149-156

Authors: Huang, JS Oates, AS Obeng, YS Brown, WL

Citation: Js. Huang et al., Asymmetrical critical current density and its influence on electromigration of two-level W-plug interconnection, J ELCHEM SO, 147(10), 2000, pp. 3840-3844