Authors:
MARCADAL C
RICHARD E
TORRES J
PALLEAU J
ULMER L
PERROUD L
PIAGUET J
ROLLAND G
Citation: C. Marcadal et al., OMCVD TIN DIFFUSION BARRIER FOR COPPER CONTACT AND VIA INTERCONNECTS STRUCTURES/, Microelectronic engineering, 37-8(1-4), 1997, pp. 197-203
Authors:
ULMER L
GEORGES L
VELER JC
MORAND Y
BAKLI M
FERRIER V
LERME M
PERROUD L
MOREL T
Citation: L. Ulmer et al., EFFECT OF TUNGSTEN CHEMICAL-VAPOR-DEPOSITION NUCLEATION STEP ON VIA PERFORMANCE, Microelectronic engineering, 33(1-4), 1997, pp. 121-127