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Results: 1-3 |
Results: 3
IN-SITU PULSED DEPOSITION STUDIES OF CE(TMHD)(4) ON SRS SURFACES FOR THIN-FILM ELECTROLUMINESCENT FLAT-PANEL DISPLAY APPLICATIONS
Authors: LAU JE BARTH KW PETERSON GG ENDISCH D TOPOL A KALOYEROS AE TUENGE RT DELAROSA M KING CN
Citation: Je. Lau et al., IN-SITU PULSED DEPOSITION STUDIES OF CE(TMHD)(4) ON SRS SURFACES FOR THIN-FILM ELECTROLUMINESCENT FLAT-PANEL DISPLAY APPLICATIONS, Journal of the Electrochemical Society, 145(12), 1998, pp. 4271-4276
INTEGRATED PLASMA-PROMOTED CHEMICAL-VAPOR-DEPOSITION ROUTE TO ALUMINUM INTERCONNECT AND PLUG TECHNOLOGIES FOR EMERGING COMPUTER CHIP METALLIZATION
Authors: FALTERMEIER J KNORR A TALEVI R GUNDLACH H KUMAR KA PETERSON GG KALOYEROS AE SULLIVAN JJ LOAN J
Citation: J. Faltermeier et al., INTEGRATED PLASMA-PROMOTED CHEMICAL-VAPOR-DEPOSITION ROUTE TO ALUMINUM INTERCONNECT AND PLUG TECHNOLOGIES FOR EMERGING COMPUTER CHIP METALLIZATION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(5), 1997, pp. 1758-1766
CHEMICAL-VAPOR-DEPOSITION OF COPPER FROM CU-I HEXAFLUOROACETYLACETONATE TRIMETHYLVINYLSILANE FOR ULTRALARGE SCALE INTEGRATION APPLICATIONS
Authors: BRAECKELMANN G MANGER D BURKE A PETERSON GG KALOYEROS AE REIDSEMA C OMSTEAD TR LOAN JF SULLIVAN JJ
Citation: G. Braeckelmann et al., CHEMICAL-VAPOR-DEPOSITION OF COPPER FROM CU-I HEXAFLUOROACETYLACETONATE TRIMETHYLVINYLSILANE FOR ULTRALARGE SCALE INTEGRATION APPLICATIONS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(3), 1996, pp. 1828-1836
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