Authors: Pinjala, D Iyer, MK Guan, CS Rasiah, IJ

Citation: D. Pinjala et al., Thermal characterization of vias using compact models, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 144-147

Authors: Sze, HP Rasiah, IJ

Citation: Hp. Sze et Ij. Rasiah, Correlation of underfill viscosity and contact angle on surfaces in a flipchip package, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 186-190

Authors: Tat, QH Rasiah, IJ

Citation: Qh. Tat et Ij. Rasiah, The study of cyanate ester underfill adhesives under typical flip chip assembly process conditions, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 228-233