Authors:
Su, X
Stagarescu, C
Xu, G
Eastman, DE
McNulty, I
Frigo, SP
Wang, YX
Retsch, CC
Noyan, IC
Hu, CK
Citation: X. Su et al., Quantitative nanoscale metrology study of Cu/SiO2 interconnect technology using transmission x-ray microscopy, APPL PHYS L, 77(21), 2000, pp. 3465-3467