Authors: Elperin, T Kornilov, A Rudin, G

Citation: T. Elperin et al., Formation of surface microcrack for separation of nonmetallic wafers into chips, J ELEC PACK, 122(4), 2000, pp. 317-322

Authors: Elperin, T Rudin, G

Citation: T. Elperin et G. Rudin, Thermal reliability testing of functionally gradient materials using thermal shock method, HEAT MASS T, 36(3), 2000, pp. 231-236