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Results: 3
A MODELING TOOL FOR THE THERMAL OPTIMIZATION OF THE REFLOW SOLDERING OF PRINTED-CIRCUIT ASSEMBLIES
Authors: SARVAR F CONWAY PP
Citation: F. Sarvar et Pp. Conway, A MODELING TOOL FOR THE THERMAL OPTIMIZATION OF THE REFLOW SOLDERING OF PRINTED-CIRCUIT ASSEMBLIES, Finite elements in analysis and design, 30(1-2), 1998, pp. 47-63
CONVECTION HEAT-TRANSFER FROM A HYBRID CIRCUIT
Authors: SARVAR F WITTING PA POOLE NJ
Citation: F. Sarvar et al., CONVECTION HEAT-TRANSFER FROM A HYBRID CIRCUIT, Journal of electronic materials, 22(7), 1993, pp. 751-754
EXAMINATION OF NATURAL-CONVECTION PLUMES FROM PARTIALLY HEATED PCB PLATES AND ESTIMATION OF THE HEAT-TRANSFER COEFFICIENTS
Authors: SARVAR F WITTING PA POOLE NJ
Citation: F. Sarvar et al., EXAMINATION OF NATURAL-CONVECTION PLUMES FROM PARTIALLY HEATED PCB PLATES AND ESTIMATION OF THE HEAT-TRANSFER COEFFICIENTS, Journal of electronic materials, 22(5), 1993, pp. 573-577
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