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Authors: TAN Q ZHANG WG SCHAIBLE B BOND LJ JU TH LEE YC
Citation: Q. Tan et al., THERMOSONIC FLIP-CHIP BONDING USING LONGITUDINAL ULTRASONIC VIBRATION, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 53-58

Authors: SCHAIBLE B LEE YC XIE H
Citation: B. Schaible et al., EFFICIENT DESIGN USING FUZZY-LOGIC BASED REGRESSION-MODELS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 132-141

Authors: SCHAIBLE B XIE H LEE YC
Citation: B. Schaible et al., FUZZY-LOGIC MODELS FOR RANKING PROCESS EFFECTS, IEEE transactions on fuzzy systems, 5(4), 1997, pp. 545-556
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