Authors:
TAN Q
ZHANG WG
SCHAIBLE B
BOND LJ
JU TH
LEE YC
Citation: Q. Tan et al., THERMOSONIC FLIP-CHIP BONDING USING LONGITUDINAL ULTRASONIC VIBRATION, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 53-58
Citation: B. Schaible et al., EFFICIENT DESIGN USING FUZZY-LOGIC BASED REGRESSION-MODELS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 132-141