Authors: BAGGERMAN AFJ SCHWARZBACH D

Citation: Afj. Baggerman et D. Schwarzbach, SOLDER-JETTED EUTECTIC PBSN BUMPS FOR FLIP-CHIP, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(4), 1998, pp. 371-381

Authors: FUCHS GM FRIEDBACHER G SCHWARZBACH D BOUVERESSE E PROHASKA T GRASSERBAUER M HAUBNER R LUX B

Citation: Gm. Fuchs et al., AFM INVESTIGATION OF SILICON SUBSTRATES FOR CHEMICAL-VAPOR-DEPOSITIONOF DIAMOND FILMS, Fresenius' journal of analytical chemistry, 353(5-8), 1995, pp. 698-701

Authors: FRIEDBACHER G BOUVERESSE E FUCHS G GRASSERBAUER M SCHWARZBACH D HAUBNER R LUX B

Citation: G. Friedbacher et al., PRETREATMENT OF SILICON SUBSTRATES FOR CVD DIAMOND DEPOSITION STUDIEDBY ATOMIC-FORCE MICROSCOPY, Applied surface science, 84(2), 1995, pp. 133-143

Authors: SCHWARZBACH D HAUBNER R LUX B

Citation: D. Schwarzbach et al., INTERNAL-STRESSES IN CVD DIAMOND LAYERS, DIAMOND AND RELATED MATERIALS, 3(4-6), 1994, pp. 757-764

Authors: TAGA K SCHWARZBACH D STINGEDER G GRASSERBAUER M KELLNER R

Citation: K. Taga et al., SURFACE-ANALYSIS AND CHARACTERIZATION OF CHEMICALLY-MODIFIED CHALCOGENIDE FIBERS, Analytical chemistry, 65(17), 1993, pp. 2288-2293