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Results: 1-10 |
Results: 10
0.4 MU-M DIAMETER NICKEL-FILAMENT SILICONE-MATRIX RESILIENT COMPOSITES FOR ELECTROMAGNETIC-INTERFERENCE SHIELDING
Authors: SHUI XP CHUNG DDL
Citation: Xp. Shui et Ddl. Chung, 0.4 MU-M DIAMETER NICKEL-FILAMENT SILICONE-MATRIX RESILIENT COMPOSITES FOR ELECTROMAGNETIC-INTERFERENCE SHIELDING, Journal of electronic packaging, 119(4), 1997, pp. 236-238
NICKEL FILAMENT POLYMER-MATRIX COMPOSITES WITH LOW SURFACE IMPEDANCE AND HIGH ELECTROMAGNETIC-INTERFERENCE SHIELDING EFFECTIVENESS
Authors: SHUI XP CHUNG DDL
Citation: Xp. Shui et Ddl. Chung, NICKEL FILAMENT POLYMER-MATRIX COMPOSITES WITH LOW SURFACE IMPEDANCE AND HIGH ELECTROMAGNETIC-INTERFERENCE SHIELDING EFFECTIVENESS, Journal of electronic materials, 26(8), 1997, pp. 928-934
ELECTROCHEMICAL-BEHAVIOR OF POROUS CARBONS
Authors: FRYSZ CA SHUI XP CHUNG DDL
Citation: Ca. Frysz et al., ELECTROCHEMICAL-BEHAVIOR OF POROUS CARBONS, Carbon, 35(7), 1997, pp. 893-916
CARBON FILAMENTS AND CARBON-BLACK AS A CONDUCTIVE ADDITIVE TO THE MANGANESE-DIOXIDE CATHODE OF A LITHIUM ELECTROLYTIC CELL
Authors: FRYSZ CA SHUI XP CHUNG DDL
Citation: Ca. Frysz et al., CARBON FILAMENTS AND CARBON-BLACK AS A CONDUCTIVE ADDITIVE TO THE MANGANESE-DIOXIDE CATHODE OF A LITHIUM ELECTROLYTIC CELL, Journal of power sources, 58(1), 1996, pp. 41-54
USE OF CARBON FILAMENTS IN-PLACE OF CARBON-BLACK AS THE CURRENT COLLECTOR OF A LITHIUM CELL WITH A THIONYL CHLORIDE BROMINE CHLORIDE CATHOLYTE
Authors: FRYSZ CA SHUI XP CHUNG DDL
Citation: Ca. Frysz et al., USE OF CARBON FILAMENTS IN-PLACE OF CARBON-BLACK AS THE CURRENT COLLECTOR OF A LITHIUM CELL WITH A THIONYL CHLORIDE BROMINE CHLORIDE CATHOLYTE, Journal of power sources, 58(1), 1996, pp. 55-66
HIGH-STRENGTH HIGH-SURFACE-AREA POROUS CARBON MADE FROM SUBMICRON-DIAMETER CARBON FILAMENTS
Authors: SHUI XP CHUNG DDL
Citation: Xp. Shui et Ddl. Chung, HIGH-STRENGTH HIGH-SURFACE-AREA POROUS CARBON MADE FROM SUBMICRON-DIAMETER CARBON FILAMENTS, Carbon, 34(6), 1996, pp. 811-814
SUBMICRON NICKEL FILAMENTS MADE BY ELECTROPLATING CARBON FILAMENTS ASA NEW FILLER MATERIAL FOR ELECTROMAGNETIC-INTERFERENCE SHIELDING
Authors: SHUI XP CHUNG DDL
Citation: Xp. Shui et Ddl. Chung, SUBMICRON NICKEL FILAMENTS MADE BY ELECTROPLATING CARBON FILAMENTS ASA NEW FILLER MATERIAL FOR ELECTROMAGNETIC-INTERFERENCE SHIELDING, Journal of electronic materials, 24(2), 1995, pp. 107-113
SOLVENT CLEANSING OF THE SURFACE OF CARBON FILAMENTS AND ITS BENEFIT TO THE ELECTROCHEMICAL-BEHAVIOR
Authors: SHUI XP FRYSZ CA CHUNG DDL
Citation: Xp. Shui et al., SOLVENT CLEANSING OF THE SURFACE OF CARBON FILAMENTS AND ITS BENEFIT TO THE ELECTROCHEMICAL-BEHAVIOR, Carbon, 33(12), 1995, pp. 1681-1698
HAIRY CARBON ELECTRODES STUDIED BY CYCLIC VOLTAMMETRY AND BATTERY DISCHARGE TESTING
Authors: SHUI XP CHUNG DDL FRYSZ CA
Citation: Xp. Shui et al., HAIRY CARBON ELECTRODES STUDIED BY CYCLIC VOLTAMMETRY AND BATTERY DISCHARGE TESTING, Journal of power sources, 47(3), 1994, pp. 313-320
EFFECT OF CHEMISORBED OXYGEN ON THE ELECTROCHEMICAL-BEHAVIOR OF GRAPHITE FIBERS
Authors: FRYSZ CA SHUI XP CHUNG DDL
Citation: Ca. Frysz et al., EFFECT OF CHEMISORBED OXYGEN ON THE ELECTROCHEMICAL-BEHAVIOR OF GRAPHITE FIBERS, Carbon, 32(8), 1994, pp. 1499-1505
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