Authors: STAVREVA Z ZEIDLER D PLOTNER M DRESCHER K

Citation: Z. Stavreva et al., CHARACTERISTICS IN CHEMICAL-MECHANICAL POLISHING OF COPPER - COMPARISON OF POLISHING PADS, Applied surface science, 108(1), 1997, pp. 39-44

Authors: STAVREVA Z ZEIDLER D PLOTNER M DRESCHER K

Citation: Z. Stavreva et al., INFLUENCE OF PROCESS PARAMETERS ON CHEMICAL-MECHANICAL POLISHING OF COPPER, Microelectronic engineering, 37-8(1-4), 1997, pp. 143-149

Authors: ZEIDLER D STAVREVA Z PLOTNER M DRESCHER K

Citation: D. Zeidler et al., THE INTERACTION BETWEEN DIFFERENT BARRIER METALS AND THE COPPER SURFACE DURING THE CHEMICAL-MECHANICAL POLISHING, Microelectronic engineering, 37-8(1-4), 1997, pp. 237-243

Authors: STAVREVA Z ZEIDLER D PLOTNER M GRASSHOFF G DRESCHER K

Citation: Z. Stavreva et al., CHEMICAL-MECHANICAL POLISHING OF COPPER FOR INTERCONNECT FORMATION, Microelectronic engineering, 33(1-4), 1997, pp. 249-257

Authors: ZEIDLER D STAVREVA Z PLOTNER M DRESCHER K

Citation: D. Zeidler et al., CHARACTERIZATION OF CU CHEMICAL-MECHANICAL POLISHING BY ELECTROCHEMICAL INVESTIGATIONS, Microelectronic engineering, 33(1-4), 1997, pp. 259-265

Authors: STAVREVA Z ZEIDLER D PLOTNER M DRESCHER K

Citation: Z. Stavreva et al., CHEMICAL-MECHANICAL POLISHING OF COPPER FOR MULTILEVEL METALLIZATION, Applied surface science, 91(1-4), 1995, pp. 192-196