Authors: SAINIO CA DUQUETTE DJ STEIGERWALD J MURARKA SP

Citation: Ca. Sainio et al., ELECTROCHEMICAL EFFECTS IN THE CHEMICAL-MECHANICAL POLISHING OF COPPER FOR INTEGRATED-CIRCUITS, Journal of electronic materials, 25(10), 1996, pp. 1593-1598

Authors: STEIGERWALD J

Citation: J. Steigerwald, ROMANTICISM IN SCIENCE - SCIENCE IN EUROPE, 1790-1840 - POGGI,S, BOSSI,M, British journal for the history of science, 28(97), 1995, pp. 240-241

Authors: LAKSHMINARAYANAN S STEIGERWALD J PRICE DT BOURGEOIS M CHOW TP GUTMANN RJ MURARKA SP

Citation: S. Lakshminarayanan et al., CONTACT AND VIA STRUCTURES WITH COPPER INTERCONNECTS FABRICATED USINGDUAL DAMASCENE TECHNOLOGY, IEEE electron device letters, 15(8), 1994, pp. 307-309

Authors: MURARKA SP STEIGERWALD J GUTMANN RJ

Citation: Sp. Murarka et al., INLAID COPPER MULTILEVEL INTERCONNECTIONS USING PLANARIZATION BY CHEMICAL-MECHANICAL POLISHING, MRS bulletin, 18(6), 1993, pp. 46-51