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Results: 1-8 |
Results: 8

Authors: Nakao, K Ishihara, S Tanaka, Y Suzuki, D Satou, I Uemura, T Tsuda, K Kizu, N Kobayashi, J
Citation: K. Nakao et al., Response time improvement of OCB mode TFT-LCDs by using capacitively coupled driving method, IEICE TR EL, E84C(11), 2001, pp. 1624-1629

Authors: Satou, I Watanabe, M Watanabe, H Itani, T
Citation: I. Satou et al., Development of advanced silylation process for 157-nm lithography, MICROEL ENG, 57-8, 2001, pp. 571-577

Authors: Satou, I Watanabe, H Endo, M Morimoto, H
Citation: I. Satou et al., Extension of the ArF excimer lithography to sub-0.10 mu m design rule devices using bi-layer silylation process, JPN J A P 1, 39(2A), 2000, pp. 442-447

Authors: Satou, I Watanabe, M Watanabe, H Itani, T
Citation: I. Satou et al., Progress in top surface imaging process, JPN J A P 1, 39(12B), 2000, pp. 6966-6971

Authors: Toriumi, M Satou, I Itani, T
Citation: M. Toriumi et al., Vacuum ultraviolet spectra of fluorocompounds for 157 nm lithography, J VAC SCI B, 18(6), 2000, pp. 3328-3331

Authors: Endo, M Satou, I Watanabe, H Morimoto, H
Citation: M. Endo et al., High sensitive negative silylation process for 193nm lithography, MICROEL ENG, 53(1-4), 2000, pp. 485-488

Authors: Satou, I Kuhara, K Endo, M Morimoto, H
Citation: I. Satou et al., Sub-0.10 mu m hole fabrication using bilayer silylation process for 193 nmlithography, JPN J A P 1, 38(12B), 1999, pp. 7008-7012

Authors: Satou, I Kuhara, K Endo, M Morimoto, H
Citation: I. Satou et al., Study of bilayer silylation process for 193 nm lithography using chemically amplified resist, J VAC SCI B, 17(6), 1999, pp. 3326-3329
Risultati: 1-8 |