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Citation: Ae. Bolzan et al., Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution. Part I. Identification of products and reaction pathway, J ELEC CHEM, 500(1-2), 2001, pp. 533-542

Authors: Haseeb, ASMA Schilardi, PL Bolzan, AE Piatti, RCV Salvarezza, RC Arvia, AJ

Citation: Asma. Haseeb et al., Anodisation of copper in thiourea-containing acid solution - Part II. In situ transversal imaging observations. Kinetics of anodic film growth, J ELEC CHEM, 500(1-2), 2001, pp. 543-553

Authors: Schilardi, PL Azzaroni, O Salvarezza, RC

Citation: Pl. Schilardi et al., A novel application of alkanethiol self-assembled monolayers in nanofabrication: Direct molding and replication of patterned conducting masters, LANGMUIR, 17(9), 2001, pp. 2748-2752

Authors: Schilardi, PL Azzaroni, O Salvarezza, RC

Citation: Pl. Schilardi et al., Stable interface dynamics for copper electrodeposition in the presence of organic additives: Evidence for a gas-like surface state of the organic adsorbate, PHYS REV B, 62(19), 2000, pp. 13098-13103

Authors: Azzaroni, O Schilardi, PL Salvarezza, RC Arvia, AJ

Citation: O. Azzaroni et al., Smoothening mechanism of thiourea on silver electrodeposition. Real time imaging of the growth front evolution, LANGMUIR, 15(4), 1999, pp. 1508-1514

Authors: Schilardi, PL Azzaroni, O Salvarezza, RC Arvia, AJ

Citation: Pl. Schilardi et al., Validity of the Kardar-Parisi-Zhang equation in the asymptotic limit of metal electrodeposition, PHYS REV B, 59(7), 1999, pp. 4638-4641