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Results: 1-2 |
Results: 2
Plasma etch-back planarization coupled to chemical mechanical polishing for sub 0.18 mu m shallow trench isolation technology
Authors: Schiltz, A Palatini, L Paoli, M Rivoire, M Prola, A
Citation: A. Schiltz et al., Plasma etch-back planarization coupled to chemical mechanical polishing for sub 0.18 mu m shallow trench isolation technology, J VAC SCI A, 18(4), 2000, pp. 1313-1320
Concept of two-dimensional swing curves for critical dimension prediction and optimization of resist/antireflective coating bilayers in topographic situations
Authors: Schiltz, A Schiavone, P
Citation: A. Schiltz et P. Schiavone, Concept of two-dimensional swing curves for critical dimension prediction and optimization of resist/antireflective coating bilayers in topographic situations, OPT ENG, 39(3), 2000, pp. 776-786
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