Authors: Seah, CH Mridha, S Chan, LH

Citation: Ch. Seah et al., DC/pulse plating of copper for trench/via filling, J MATER PR, 114(3), 2001, pp. 233-239

Authors: Seah, CH Mridha, S Chan, LH

Citation: Ch. Seah et al., Adhesive strength of electroplated copper films, J MATER PR, 114(3), 2001, pp. 252-256

Authors: Seah, CH Mridha, S Chan, LH

Citation: Ch. Seah et al., Quality of electroplated copper films produced using different acid electrolytes, J VAC SCI B, 17(5), 1999, pp. 2352-2356

Authors: Seah, CH Mridha, S Chan, LH

Citation: Ch. Seah et al., Fabrication of DC-plated nanocrystalline copper electrodeposits, J MATER PR, 90, 1999, pp. 432-436

Authors: Seah, CH Mridha, S Chan, LH

Citation: Ch. Seah et al., Annealing of copper electrodeposits, J VAC SCI A, 17(4), 1999, pp. 1963-1967