Authors:
Shin, CK
Rodino, W
Kirwin, JD
Wisselink, W
Abruzzo, FM
Panetta, TF
Citation: Ck. Shin et al., Can preoperative spiral CT scans alone determine the feasibility of endovascular AAA repair? A comparison to angiographic measurements, J ENDOVAS T, 7(3), 2000, pp. 177-183
Authors:
Shin, CK
Lee, H
Lee, DR
Jung, CS
Kim, D
Rhee, BK
Citation: Ck. Shin et al., A comparative study of third-order electronic and thermally induced optical nonlinearity in a polythiophene thin film, J KOR PHYS, 36(6), 2000, pp. 356-359
Citation: Ck. Shin et Sc. Park, A machine learning approach to yield management in semiconductor manufacturing, INT J PROD, 38(17), 2000, pp. 4261-4271
Citation: Ck. Shin et Jy. Huh, Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 406-411
Authors:
Shin, CK
Rodino, W
Kirwin, JD
Ramirez, JA
Wisselink, W
Papierman, G
Panetta, TF
Citation: Ck. Shin et al., Histology and electron microscopy of explanted bifurcated endovascular aortic grafts: Evidence of early incorporation and healing, J ENDOVAS S, 6(3), 1999, pp. 246-250
Authors:
Wisselink, W
Abruzzo, FM
Shin, CK
Ramirez, JR
Rodino, W
Kirwin, JD
Panetta, TF
Citation: W. Wisselink et al., Endoluminal repair of aneurysms containing ostia of essential branch arteries: An experimental model, J ENDOVAS S, 6(2), 1999, pp. 171-179
Authors:
Hong, HK
Ha, SH
Shin, CK
Park, SC
Kim, SH
Citation: Hk. Hong et al., Evaluating the efficiency of system integration projects using data envelopment analysis (DEA) and machine learning, EXPER SY AP, 16(3), 1999, pp. 283-296