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Results: 3
Chemical-mechanical polishing of SiOC organosilicate glasses: the effect of film carbon content
Authors:
Borst, CL Korthuis, V Shinn, GB Luttmer, JD Gutmann, RJ Gill, WN
Citation:
Cl. Borst et al., Chemical-mechanical polishing of SiOC organosilicate glasses: the effect of film carbon content, THIN SOL FI, 385(1-2), 2001, pp. 281-292
Optimization of the chemical mechanical polishing process for premetal dielectrics
Authors:
Fang, SJ Garza, S Guo, HL Smith, TH Shinn, GB Campbell, JE Hartsell, RL
Citation:
Sj. Fang et al., Optimization of the chemical mechanical polishing process for premetal dielectrics, J ELCHEM SO, 147(2), 2000, pp. 682-686
On-line patterned wafer thickness control of chemical-mechanical polishing
Authors:
Smith, TH Fang, SJ Stefani, JA Shinn, GB Boning, DS Butler, SW
Citation:
Th. Smith et al., On-line patterned wafer thickness control of chemical-mechanical polishing, J VAC SCI A, 17(4), 1999, pp. 1384-1390
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