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Results: 1-11 |
Results: 11
Thermal and mechanical characterization of ViaLuX (TM) 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications
Authors: Dunne, RC Sitaraman, SK Luo, SJ Wong, CP Estes, WE Periyasamy, M Coburn, J
Citation: Rc. Dunne et al., Thermal and mechanical characterization of ViaLuX (TM) 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications, IEEE T COMP, 24(3), 2001, pp. 436-444
Numerical modeling of interfacial delamination propagation in a novel peripheral array package
Authors: Harries, RJ Sitaraman, SK
Citation: Rj. Harries et Sk. Sitaraman, Numerical modeling of interfacial delamination propagation in a novel peripheral array package, IEEE T COMP, 24(2), 2001, pp. 256-264
Interfacial fracture toughness for delamination growth prediction in a novel peripheral away package
Authors: Sundararaman, V Sitaraman, SK
Citation: V. Sundararaman et Sk. Sitaraman, Interfacial fracture toughness for delamination growth prediction in a novel peripheral away package, IEEE T COMP, 24(2), 2001, pp. 265-270
Development of virtual reliability methodology for area-array devices usedin implantable and automotive applications
Authors: Sitaraman, SK Raghunathan, R Hanna, CE
Citation: Sk. Sitaraman et al., Development of virtual reliability methodology for area-array devices usedin implantable and automotive applications, IEEE T COMP, 23(3), 2000, pp. 452-461
Die-cracking and reliable die design for flip-chip assemblies (vol 22, pg 602, 1999)
Authors: Michaelides, S Sitaraman, SK
Citation: S. Michaelides et Sk. Sitaraman, Die-cracking and reliable die design for flip-chip assemblies (vol 22, pg 602, 1999), IEEE T AD P, 23(1), 2000, pp. 121-121
Role of out-of-plane coefficient of thermal expansion in electronic packaging modeling
Authors: Variyam, MN Xie, WD Sitaraman, SK
Citation: Mn. Variyam et al., Role of out-of-plane coefficient of thermal expansion in electronic packaging modeling, J ELEC PACK, 122(2), 2000, pp. 121-127
New reworkable high temperature low modulus (in excess of 400-500 degrees C) adhesives for MCM-D assembly
Authors: Wu, JL Pike, RT Sitaraman, SK Wong, CP
Citation: Jl. Wu et al., New reworkable high temperature low modulus (in excess of 400-500 degrees C) adhesives for MCM-D assembly, J ELEC PACK, 122(1), 2000, pp. 55-60
Interfacial thermal stress analysis of anisotropic multi-layered electronic packaging structures
Authors: Xie, WD Sitaraman, SK
Citation: Wd. Xie et Sk. Sitaraman, Interfacial thermal stress analysis of anisotropic multi-layered electronic packaging structures, J ELEC PACK, 122(1), 2000, pp. 61-66
Investigation of the curing behavior of a novel epoxy photo-dielectric dryfilm (ViaLux (TM) 81) for high density interconnect applications
Authors: Dunne, RC Sitaraman, SK Luo, SJ Rao, Y Wong, CP Estes, WE Gonzalez, CG Coburn, JC Periyasamy, M
Citation: Rc. Dunne et al., Investigation of the curing behavior of a novel epoxy photo-dielectric dryfilm (ViaLux (TM) 81) for high density interconnect applications, J APPL POLY, 78(2), 2000, pp. 430-437
Die cracking and reliable die design for flip-chip assemblies
Authors: Michaelides, S Sitaraman, SK
Citation: S. Michaelides et Sk. Sitaraman, Die cracking and reliable die design for flip-chip assemblies, IEEE T AD P, 22(4), 1999, pp. 602-613
Determination of fracture toughness for metal/polymer interfaces
Authors: Sundararaman, V Sitaraman, SK
Citation: V. Sundararaman et Sk. Sitaraman, Determination of fracture toughness for metal/polymer interfaces, J ELEC PACK, 121(4), 1999, pp. 275-281
Risultati: 1-11 |