Authors: Nilsson, P Jonsson, M Stenmark, L

Citation: P. Nilsson et al., Chip mounting and interconnection in multi-chip modules for space applications, J MICROM M, 11(4), 2001, pp. 339-343

Authors: Jonsson, K Kohler, J Hedlund, C Stenmark, L

Citation: K. Jonsson et al., Oxygen plasma wafer bonding evaluated by the Weibull fracture probability method, J MICROM M, 11(4), 2001, pp. 364-370

Authors: Brogren, M Harding, GL Karmhag, R Ribbing, CG Niklasson, GA Stenmark, L

Citation: M. Brogren et al., Titanium-aluminum-nitride coatings for satellite temperature control, THIN SOL FI, 370(1-2), 2000, pp. 268-277

Authors: Kohler, J Jonsson, K Greek, S Stenmark, L

Citation: J. Kohler et al., Weibull fracture probability for silicon wafer bond evaluation, J ELCHEM SO, 147(12), 2000, pp. 4683-4687