Citation: Jh. Wu et al., A 3-DIMENSIONAL MODELING OF WIRE SWEEP INCORPORATING RESIN CURE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 65-72
Citation: Aao. Tay et Ty. Lin, MOISTURE DIFFUSION AND HEAT-TRANSFER IN PLASTIC IC PACKAGES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 186-193
Citation: Kwl. Loh et al., EFFECT OF CONSTITUTIVE MODELS ON THE NUMERICAL-SIMULATION OF VISCOELASTIC FLOW AT AN ENTRY REGION, Polymer engineering and science, 36(15), 1996, pp. 1990-2000
Citation: Aao. Tay et al., THE EFFECT OF WIREBOND GEOMETRY AND DIE SETTING ON WIRE SWEEP, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 201-209
Citation: Aao. Tay et al., PREDICTING DELAMINATION IN PLASTIC IC PACKAGES AND DETERMINING SUITABLE MOLD COMPOUND PROPERTIES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(2), 1994, pp. 201-208
Citation: Te. Tay et al., ANALYSIS OF STRESSES IN CROSS-PLY COMPOSITE LAMINATES CONTAINING DISTRIBUTED TRANSVERSE CRACKS, Finite elements in analysis and design, 18(1-3), 1994, pp. 301-308
Citation: Aao. Tay, THE IMPORTANCE OF ALLOWING FOR THE VARIATION OF THERMAL-PROPERTIES INTHE NUMERICAL COMPUTATION OF TEMPERATURE DISTRIBUTION IN MACHINING, Journal of materials processing technology, 28(1-2), 1991, pp. 49-58