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Results: 1-9 |
Results: 9
A 3-DIMENSIONAL MODELING OF WIRE SWEEP INCORPORATING RESIN CURE
Authors: WU JH TAY AAO YEO KS LIM TB
Citation: Jh. Wu et al., A 3-DIMENSIONAL MODELING OF WIRE SWEEP INCORPORATING RESIN CURE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 65-72
MOISTURE DIFFUSION AND HEAT-TRANSFER IN PLASTIC IC PACKAGES
Authors: TAY AAO LIN TY
Citation: Aao. Tay et Ty. Lin, MOISTURE DIFFUSION AND HEAT-TRANSFER IN PLASTIC IC PACKAGES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 186-193
COMPUTER-SIMULATION OF VISCOELASTIC FLOW AT THE ENTRY REGION
Authors: LOH KWL TEOH SH TAY AAO
Citation: Kwl. Loh et al., COMPUTER-SIMULATION OF VISCOELASTIC FLOW AT THE ENTRY REGION, Polymer engineering and science, 36(3), 1996, pp. 368-377
EFFECT OF CONSTITUTIVE MODELS ON THE NUMERICAL-SIMULATION OF VISCOELASTIC FLOW AT AN ENTRY REGION
Authors: LOH KWL TAY AAO TEOH SH
Citation: Kwl. Loh et al., EFFECT OF CONSTITUTIVE MODELS ON THE NUMERICAL-SIMULATION OF VISCOELASTIC FLOW AT AN ENTRY REGION, Polymer engineering and science, 36(15), 1996, pp. 1990-2000
THE EFFECT OF WIREBOND GEOMETRY AND DIE SETTING ON WIRE SWEEP
Authors: TAY AAO YEO KS WU JH
Citation: Aao. Tay et al., THE EFFECT OF WIREBOND GEOMETRY AND DIE SETTING ON WIRE SWEEP, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 201-209
WIREBOND DEFORMATION DURING MOLDING OF IC PACKAGES
Authors: TAY AAO YEO KS WU JH LIM TB
Citation: Aao. Tay et al., WIREBOND DEFORMATION DURING MOLDING OF IC PACKAGES, Journal of electronic packaging, 117(1), 1995, pp. 14-19
PREDICTING DELAMINATION IN PLASTIC IC PACKAGES AND DETERMINING SUITABLE MOLD COMPOUND PROPERTIES
Authors: TAY AAO TAN GL LIM TB
Citation: Aao. Tay et al., PREDICTING DELAMINATION IN PLASTIC IC PACKAGES AND DETERMINING SUITABLE MOLD COMPOUND PROPERTIES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(2), 1994, pp. 201-208
ANALYSIS OF STRESSES IN CROSS-PLY COMPOSITE LAMINATES CONTAINING DISTRIBUTED TRANSVERSE CRACKS
Authors: TAY TE LIM EH TAY AAO
Citation: Te. Tay et al., ANALYSIS OF STRESSES IN CROSS-PLY COMPOSITE LAMINATES CONTAINING DISTRIBUTED TRANSVERSE CRACKS, Finite elements in analysis and design, 18(1-3), 1994, pp. 301-308
THE IMPORTANCE OF ALLOWING FOR THE VARIATION OF THERMAL-PROPERTIES INTHE NUMERICAL COMPUTATION OF TEMPERATURE DISTRIBUTION IN MACHINING
Authors: TAY AAO
Citation: Aao. Tay, THE IMPORTANCE OF ALLOWING FOR THE VARIATION OF THERMAL-PROPERTIES INTHE NUMERICAL COMPUTATION OF TEMPERATURE DISTRIBUTION IN MACHINING, Journal of materials processing technology, 28(1-2), 1991, pp. 49-58
Risultati: 1-9 |