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Results:
1-9
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Results: 9
Authors:
Huang, ZM
Ramakrishna, S
Zhang, YZ
Tay, AAO
Citation: Zm. Huang et al., Prediction of tensile strength of multilayer knitted-fabric-reinforced laminated composites, J THERM COM, 14(1), 2001, pp. 70-83
Authors:
Ramakrishna, S
Huang, ZM
Teoh, SH
Tay, AAO
Chew, CL
Citation: S. Ramakrishna et al., Application of the model of leaf and glaskin to estimating the 3D elastic properties of knitted-fabric-reinforced composites, J TEXTILE I, 91(1), 2000, pp. 132-150
Authors:
Huang, ZM
Ramakrishna, S
Tay, AAO
Citation: Zm. Huang et al., Unified micromechanical model for estimating elastic, elasto-plastic and strength behaviors of knitted fabric reinforced composites, J REINF PL, 19(8), 2000, pp. 642-656
Authors:
Huang, ZM
Ramakrishna, S
Tay, AAO
Citation: Zm. Huang et al., Modeling the stress/strain behavior of a knitted fabric-reinforced elastomer composite, COMP SCI T, 60(5), 2000, pp. 671-691
Authors:
Danto, Y
Lall, P
Tay, AAO
Citation: Y. Danto et al., Microelectronic packaging and assembling, MICROEL REL, 40(7), 2000, pp. 1069-1071
Authors:
Zhang, GQ
Tay, AAO
Ernst, LJ
Citation: Gq. Zhang et al., Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 263-269
Authors:
Tay, AAO
Lee, KH
Zhou, W
Lim, KM
Citation: Aao. Tay et al., A methodology for predicting failure sites and failure modes in an IC package, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 270-276
Authors:
Tay, AAO
Lin, TY
Citation: Aao. Tay et Ty. Lin, Influence of temperature, humidity, and defect location on delamination inplastic IC packages, IEEE T COMP, 22(4), 1999, pp. 512-518
Authors:
Huang, ZM
Ramakrishna, S
Dinner, HP
Tay, AAO
Citation: Zm. Huang et al., Characterization of a knitted fabric reinforced elastomer composite, J REINF PL, 18(2), 1999, pp. 118-137
Risultati:
1-9
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