Authors:
Tee, KC
Prasad, K
Lee, CS
Gong, H
Cha, CL
Chan, L
See, AK
Citation: Kc. Tee et al., Effects of deliberate copper contamination from the plating solution on the electrical characteristics of MOSFETs, IEEE SEMIC, 14(2), 2001, pp. 170-172
Authors:
Cha, CL
Tee, KC
Chor, EF
Gong, H
Prasad, K
Bourdillon, AJ
See, A
Chan, L
Lee, MMO
Citation: Cl. Cha et al., Enhancement of hot-carrier injection resistance for deep submicron transistor gate dielectric with a powered solenoid, APPL PHYS L, 75(26), 1999, pp. 4192-4194