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Results: 1-12 |
Results: 12

Authors: Sangsuwan, P Orejas, JA Gatica, JE Tewari, SN Singh, M
Citation: P. Sangsuwan et al., Reaction-bonded silicon carbide by reactive infiltration, IND ENG RES, 40(23), 2001, pp. 5191-5198

Authors: Goller, G Koty, DP Tewari, SN Singh, M Tekin, A
Citation: G. Goller et al., Wear and friction behavior of pressure infiltration cast copper-carbon composites, SC J METALL, 30(2), 2001, pp. 77-83

Authors: Trivedi, R Miyahara, H Mazumder, P Simsek, E Tewari, SN
Citation: R. Trivedi et al., Directional solidification microstructures in diffusive and convective regimes, J CRYST GR, 222(1-2), 2001, pp. 365-379

Authors: Ojha, SN Tewari, SN
Citation: Sn. Ojha et Sn. Tewari, Effect of growth rate on macrosegregation during directional solidification of a Pb-Sb alloy, INT J CAST, 13(4), 2000, pp. 207-213

Authors: Yu, L Ding, GL Reye, J Ojha, SN Tewari, SN
Citation: L. Yu et al., Mushy zone morphology during directional solidification of Pb-5.8 wt pct Sb alloy, MET MAT T A, 31(9), 2000, pp. 2275-2285

Authors: Asthana, R Tewari, SN
Citation: R. Asthana et Sn. Tewari, Interface response to solidification in sapphire-reinforced Ni-base composites, ADV COM MAT, 9(4), 2000, pp. 265-307

Authors: Song, H Tewari, SN Singh, M
Citation: H. Song et al., Degradation of aluminum alloy-carbon composites due to humidity, J MAT SCI L, 19(3), 2000, pp. 209-211

Authors: Yu, L Ding, GL Reye, J Ojha, SN Tewari, SN
Citation: L. Yu et al., Cellular/dendritic array tip morphology during directional solidification of Pb-5.8 wt pct Sb alloy, MET MAT T A, 30(9), 1999, pp. 2463-2472

Authors: O'Dell, SP Ding, GL Tewari, SN
Citation: Sp. O'Dell et al., Cell/dendrite distribution in directionally solidified hypoeutectic Pb-Sb alloys, MET MAT T A, 30(8), 1999, pp. 2159-2165

Authors: Ojha, SN Ding, G Lu, Y Reye, J Tewari, SN
Citation: Sn. Ojha et al., Macrosegregation caused by thermosolutal convection during directional solidification of Pb-Sb alloys, MET MAT T A, 30(8), 1999, pp. 2167-2171

Authors: Datta, SK Tewari, SN Gatica, JE Shih, W Bentsen, L
Citation: Sk. Datta et al., Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications, MET MAT T A, 30(1), 1999, pp. 175-181

Authors: Sangsuwan, P Tewari, SN Gatica, JE Singh, M Dickerson, R
Citation: P. Sangsuwan et al., Reactive infiltration of silicon melt through microporous amorphous carbonpreforms, MET MAT T B, 30(5), 1999, pp. 933-944
Risultati: 1-12 |