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Initial process-parameters setting of transfer moulding in microchip encapsulation: a case-based reasoning approach
Authors:
Tong, KW Kwong, CK Chan, CY
Citation:
Kw. Tong et al., Initial process-parameters setting of transfer moulding in microchip encapsulation: a case-based reasoning approach, J MATER PR, 113(1-3), 2001, pp. 432-438
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