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Effect of surface condition and bonding pressure on quality of diffusion bonded high purity copper for linear collider accelerator structures
Authors: Elmer, JW Klingman, J Van Bibber, K
Citation: Jw. Elmer et al., Effect of surface condition and bonding pressure on quality of diffusion bonded high purity copper for linear collider accelerator structures, SCI TEC W J, 6(5), 2001, pp. 268-272
Diffusion bonding and brazing of high purity copper for linear collider accelerator structures - art. no. 053502
Authors: Elmer, JW Klingmann, J Van Bibber, K
Citation: Jw. Elmer et al., Diffusion bonding and brazing of high purity copper for linear collider accelerator structures - art. no. 053502, PHY R SPE T, 4(5), 2001, pp. NIL_12-NIL_27
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