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Results: 1-25/44
Authors:
Martin, LJ
Wong, CP
Citation: Lj. Martin et Cp. Wong, Chemical and mechanical adhesion mechanisms of sputter-deposited metal on epoxy dielectric for high density interconnect printed circuit boards, IEEE T COMP, 24(3), 2001, pp. 416-424
Authors:
Dunne, RC
Sitaraman, SK
Luo, SJ
Wong, CP
Estes, WE
Periyasamy, M
Coburn, J
Citation: Rc. Dunne et al., Thermal and mechanical characterization of ViaLuX (TM) 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications, IEEE T COMP, 24(3), 2001, pp. 436-444
Authors:
Luo, SJ
Wong, CP
Citation: Sj. Luo et Cp. Wong, Study on effect of coupling agents on underfill material in flip chip packaging, IEEE T COMP, 24(1), 2001, pp. 38-42
Authors:
Luo, SJ
Wong, CP
Citation: Sj. Luo et Cp. Wong, Effect of UV/ozone treatment on surface tension and adhesion in electronicpackaging, IEEE T COMP, 24(1), 2001, pp. 43-49
Authors:
Zhang, ZQ
Shi, SH
Wong, CP
Citation: Zq. Zhang et al., Development of no-flow underfill materials for lead-free solder bumped flip-chip applications, IEEE T COMP, 24(1), 2001, pp. 59-66
Authors:
Schleicher, R
Raffray, AR
Wong, CP
Citation: R. Schleicher et al., An assessment of the Brayton cycle for high performance power plants, FUSION TECH, 39(2), 2001, pp. 823-827
Authors:
Ziakas, NG
Wong, CP
Ramsay, AS
Bamashmus, MA
Forsyth, RJ
Eyre, JA
Clarke, MP
Citation: Ng. Ziakas et al., Visual impairment in children with acute nontraumatic coma, J PEDIAT OP, 38(1), 2001, pp. 6-10
Authors:
Walter, DM
Wong, CP
DeKruyff, RH
Berry, GJ
Levy, S
Umetsu, DT
Citation: Dm. Walter et al., IL-18 gene transfer by adenovirus prevents the development of and reversesestablished allergen-induced airway hyperreactivity, J IMMUNOL, 166(10), 2001, pp. 6392-6398
Authors:
Wang, LJ
Wong, CP
Citation: Lj. Wang et Cp. Wong, Study of additive-epoxy interaction of thermally reworkable underfills, J APPL POLY, 81(8), 2001, pp. 1868-1880
Authors:
Wong, CP
Forsyth, RJ
Kelly, TP
Eyre, JA
Citation: Cp. Wong et al., Incidence, aetiology, and outcome of non-traumatic coma: a population based study, ARCH DIS CH, 84(3), 2001, pp. 193-199
Authors:
Forsyth, RJ
Wong, CP
Kelly, TP
Borrill, H
Stilgoe, D
Kendall, S
Eyre, JA
Citation: Rj. Forsyth et al., Cognitive and adaptive outcomes and age at insult effects after non-traumatic coma, ARCH DIS CH, 84(3), 2001, pp. 200-204
Authors:
Lu, DQ
Wong, CP
Citation: Dq. Lu et Cp. Wong, Development of conductive adhesives for solder replacement, IEEE T COMP, 23(4), 2000, pp. 620-626
Authors:
Rao, Y
Qu, JM
Marinis, T
Wong, CP
Citation: Y. Rao et al., A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory, IEEE T COMP, 23(4), 2000, pp. 680-683
Authors:
Rao, Y
Shi, SH
Wong, CP
Citation: Y. Rao et al., An improved methodology for determining temperature dependent moduli of underfill encapsulants, IEEE T COMP, 23(3), 2000, pp. 434-439
Authors:
Lu, DQ
Wong, CP
Citation: Dq. Lu et Cp. Wong, A study of contact resistance of conductive adhesives based on anhydride-cured epoxy systems, IEEE T COMP, 23(3), 2000, pp. 440-446
Authors:
Luo, SJ
Wong, CP
Citation: Sj. Luo et Cp. Wong, Study on effect of carbon black on behavior of conductive polymer composites with positive temperature coefficient, IEEE T COMP, 23(1), 2000, pp. 151-156
Authors:
Wu, JL
Pike, RT
Wong, CP
Kim, NP
Tanielian, MH
Citation: Jl. Wu et al., Evaluation and characterization of reliable non-hermetic conformal coatings for microelectromechanical system (MEMS) device encapsulation, IEEE T AD P, 23(4), 2000, pp. 721-728
Authors:
Garrou, P
Scheck, D
Im, JH
Hetzner, J
Meyers, G
Hawn, D
Wu, JL
Vincent, MB
Wong, CP
Citation: P. Garrou et al., Underfill adhesion to BCB (Cyclotene(TM)) bumping and redistribution dielectrics, IEEE T AD P, 23(3), 2000, pp. 568-573
Authors:
Lu, D
Wong, CP
Citation: D. Lu et Cp. Wong, Thermal decomposition of silver flake lubricants, J THERM ANA, 61(1), 2000, pp. 3-12
Authors:
Lu, D
Wong, CP
Citation: D. Lu et Cp. Wong, Characterization of silver flake lubricants, J THERM ANA, 59(3), 2000, pp. 729-740
Authors:
Wu, JL
Pike, RT
Sitaraman, SK
Wong, CP
Citation: Jl. Wu et al., New reworkable high temperature low modulus (in excess of 400-500 degrees C) adhesives for MCM-D assembly, J ELEC PACK, 122(1), 2000, pp. 55-60
Authors:
Wang, LJ
Li, HY
Wong, CP
Citation: Lj. Wang et al., Syntheses and characterizations of thermally reworkable epoxy resins II, J POL SC PC, 38(20), 2000, pp. 3771-3782
Authors:
Lu, DQ
Wong, CP
Citation: Dq. Lu et Cp. Wong, Effects of shrinkage on conductivity of isotropic conductive adhesives, INT J ADHES, 20(3), 2000, pp. 189-193
Authors:
Wong, CP
Luo, SJ
Zhang, ZQ
Citation: Cp. Wong et al., Microelectronics - Flip the chip, SCIENCE, 290(5500), 2000, pp. 2269
Authors:
Dunne, RC
Sitaraman, SK
Luo, SJ
Rao, Y
Wong, CP
Estes, WE
Gonzalez, CG
Coburn, JC
Periyasamy, M
Citation: Rc. Dunne et al., Investigation of the curing behavior of a novel epoxy photo-dielectric dryfilm (ViaLux (TM) 81) for high density interconnect applications, J APPL POLY, 78(2), 2000, pp. 430-437