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Results: 26-44/44
Authors:
Wong, CP
Levy, R
Citation: Cp. Wong et R. Levy, Recombinant adenovirus vaccine encoding a chimeric T-cell antigen receptorinduces protective immunity against a T-cell lymphoma, CANCER RES, 60(10), 2000, pp. 2689-2695
Authors:
Tummala, RR
Wong, CP
Chan, YC
Citation: Rr. Tummala et al., Microelectronic packaging and assembly roadmap for Hong Kong and Pearl River Delta region: A team study and recommendations, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 21-23
Authors:
Wong, CP
Lu, D
Citation: Cp. Wong et D. Lu, Development of solder replacement isotropic conductive adhesives, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 214-222
Authors:
Zhang, ZQ
Wong, CP
Citation: Zq. Zhang et Cp. Wong, Development of no-flow underfill for lead-free bumped flip-chip assemblies, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 234-240
Authors:
Lu, DQ
Tong, QK
Wong, CP
Citation: Dq. Lu et al., A study of lubricants on silver flakes for microelectronics conductive adhesives, IEEE T COMP, 22(3), 1999, pp. 365-371
Authors:
Shi, SH
Wong, CP
Citation: Sh. Shi et Cp. Wong, Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications, IEEE T COMP, 22(2), 1999, pp. 141-151
Authors:
Wong, CP
Citation: Cp. Wong, Contributions from the Second International Symposium on Electronic Packaging Technology - Foreword, IEEE T COMP, 22(1), 1999, pp. 5-5
Authors:
Wong, CP
Wong, MM
Citation: Cp. Wong et Mm. Wong, Recent advances in plastic packaging of flip-chip and multichip modules (MCM) of microelectronics, IEEE T COMP, 22(1), 1999, pp. 21-25
Authors:
Wang, LJ
Wong, CP
Citation: Lj. Wang et Cp. Wong, Novel thermally reworkable underfill encapsulants for flip-chip applications, IEEE T AD P, 22(1), 1999, pp. 46-53
Authors:
Wong, CP
Bollampally, RS
Citation: Cp. Wong et Rs. Bollampally, Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging, IEEE T AD P, 22(1), 1999, pp. 54-59
Authors:
Wong, CP
Wang, LJ
Shi, SH
Citation: Cp. Wong et al., Novel high performance no flow and reworkable underfills for flip-chip applications, MAT RES INN, 2(4), 1999, pp. 232-247
Authors:
Vincent, MB
Wong, CP
Citation: Mb. Vincent et Cp. Wong, Enhancement of underfill encapsulants for flip-chip technology, SOLDER S MT, 11(3), 1999, pp. 33-39
Authors:
Wang, LJ
Wong, CP
Citation: Lj. Wang et Cp. Wong, Syntheses and characterizations of thermally reworkable epoxy resins. PartI, J POL SC PC, 37(15), 1999, pp. 2991-3001
Authors:
Wong, CP
Okada, CY
Levy, R
Citation: Cp. Wong et al., TCR vaccines against T cell lymphoma: QS-21 and IL-12 adjuvants induce a protective CD8(+) T cell response, J IMMUNOL, 162(4), 1999, pp. 2251-2258
Authors:
Lu, DQ
Wong, CP
Citation: Dq. Lu et Cp. Wong, Novel conductive adhesives for surface mount applications, J APPL POLY, 74(2), 1999, pp. 399-406
Authors:
Wong, CP
Bollampally, RS
Citation: Cp. Wong et Rs. Bollampally, Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging, J APPL POLY, 74(14), 1999, pp. 3396-3403
Authors:
Wong, CP
Wu, JL
Pike, RT
Citation: Cp. Wong et al., Characterization of reworkable high-temperature adhesives for MCM-D application, J APPL POLY, 73(6), 1999, pp. 997-1005
Authors:
Shi, SH
Wong, CP
Citation: Sh. Shi et Cp. Wong, Effects of the complexed moisture in metal acetylacetonate on the properties of the no-flow underfill materials, J APPL POLY, 73(1), 1999, pp. 103-111
Authors:
Lee, TH
Ge, SS
Wong, CP
Citation: Th. Lee et al., Adaptive neural network feedback control of a passive line-of-sight stabilization system, MECHATRONIC, 8(8), 1998, pp. 887-903