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Results:
1-9
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Results: 9
Authors:
ZHOU Y
WANG DX
DU MY
ZHU JH
SHAN GJ
MA DQ
XIE DJ
MA Q
HU XH
Citation: Y. Zhou et al., LIDOCAINE PROLONGS THE SAFE DURATION OF CIRCULATORY ARREST DURING DEEP HYPOTHERMIA IN DOGS, Canadian journal of anaesthesia, 45(7), 1998, pp. 692-698
Authors:
XIE DJ
WANG ZP
Citation: Dj. Xie et Zp. Wang, PROCESS CAPABILITY STUDY AND THERMAL FATIGUE LIFE PREDICTION OF CERAMIC BGA SOLDER JOINTS, Finite elements in analysis and design, 30(1-2), 1998, pp. 31-45
Authors:
XIE DJ
GUTSCHE CD
Citation: Dj. Xie et Cd. Gutsche, CALIXARENE ANHYDRIDES AS USEFUL SYNTHETIC INTERMEDIATES, Journal of organic chemistry, 62(7), 1997, pp. 2280-2284
Authors:
XIE DJ
CHAN YC
LAI JKL
HUI IK
Citation: Dj. Xie et al., FATIGUE LIFE ESTIMATION OF SURFACE-MOUNT SOLDER JOINTS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 669-678
Authors:
XIE DJ
CHAN YC
LAI JKL
HUI IK
Citation: Dj. Xie et al., FATIGUE LIFE STUDIES ON DEFECT-FREE SOLDER JOINTS FABRICATED FROM MODIFIED REFLOW SOLDERING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 679-684
Authors:
XIE DJ
CHAN YC
LAI JKL
Citation: Dj. Xie et al., AN EXPERIMENTAL APPROACH TO PORE-FREE REFLOW SOLDERING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 148-153
Authors:
CHAN YC
XIE DJ
LAI JKL
Citation: Yc. Chan et al., EXPERIMENTAL STUDIES OF PORE FORMATION IN SURFACE-MOUNT SOLDER JOINTS, Materials science & engineering. B, Solid-state materials for advanced technology, 38(1-2), 1996, pp. 53-61
Authors:
CHAN YC
XIE DJ
LAI JKL
HUI IK
Citation: Yc. Chan et al., APPLICATION OF DIRECT STRAIN-MEASUREMENT TO FATIGUE STUDIES IN SURFACE SOLDER JOINTS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(4), 1995, pp. 715-719
Authors:
CHAN YC
XIE DJ
LAI JKL
Citation: Yc. Chan et al., CHARACTERISTICS OF POROSITY IN SOLDER PASTES DURING INFRARED REFLOW SOLDERING, Journal of Materials Science, 30(21), 1995, pp. 5543-5550
Risultati:
1-9
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